In a significant move to bolster domestic semiconductor production, Apple has unveiled a multi-year agreement with Broadcom to invest over $30 billion in U.S.-based chip manufacturing. This partnership aims to produce more than 15 billion chips, enhancing Apple’s American supply chain and supporting the company’s ambition to establish a comprehensive U.S. chip ecosystem encompassing both design and production.
This initiative is poised to create hundreds of jobs and increase the production of advanced wireless technologies integral to Apple devices. As part of this collaboration, Broadcom will allocate $1.5 billion to expand and modernize its manufacturing facility in Fort Collins, Colorado. The upgraded facility will focus on producing advanced radio frequency components, such as FBAR filters, which are critical for improving wireless performance and connectivity in Apple’s products.
Apple CEO Tim Cook emphasized that this partnership underscores Apple’s enduring commitment to U.S. manufacturing and innovation. He highlighted the importance of the components manufactured in Colorado in meeting the performance and wireless capabilities that customers expect from Apple devices. Cook also expressed pride in strengthening investments in U.S.-based suppliers specializing in advanced technology and high-quality manufacturing.
Broadcom CEO Hock Tan praised the extended partnership with Apple, expressing the company’s shared dedication to advancing American innovation and manufacturing. This new agreement is a key element of Apple’s previously announced $600 billion U.S. investment strategy, which includes expanding its manufacturing capacity, developing AI server facilities in Texas, and creating more high-skilled jobs nationwide.